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Oct 16, 2024
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2024-2025 Undergraduate Catalog
Surface Mount Technology Minor
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Program Coordinator/Contact
Julian Kang, Department Head
Department of Construction and Concrete Industry Management
Solberg Hall 116
605-688-6417
Program Information
The minor in Surface Mount Technology (SMT) provides knowledge and skills in manufacturing processes, materials and methods for production of printed circuit board, quality control and inspection of processes and products, lean processes, and SMT processes and methods. Students earning a minor in Surface Mount Technology will be able to pursue careers in printed circuit board manufacturing, a rapidly expanding career area due to the increasing number of integrated circuit chips used in modern products.
Course Delivery Format
The program provides coursework on the Brookings campus in classroom, laboratory, and field-based settings.
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Student Learning Outcomes
At the completion of the Surface Mount Technology minor, graduates will be able to:
- Describe the Institute of Printed Circuits (IPC) standards and printed circuit board structure and materials.
- Describe manufacturing processes and methods including LEAN, Screen Printing, Component Pick and Place, Soldering and Test procedures.
- Describe and demonstrate quality control methods and processes used in Printed Circuit board manufacture.
- Identify different types of machines used in manufacturing printed circuit boards.
- Demonstrate the use of statistical tests used in manufacturing processes.
Requirements for Surface Mount Technology Minor: 18 Credits
Total Required Credits: 18
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